Research Expertise

•	Multi-scale modeling of physical phenomena
•	Micro/nano-scale testing and measurement techniques
•	Stress and failure analysis of electronic components
•	Fatigue reliability of solder joints in electronic packages
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Education

•	Ph.D.	:	Mechanical Engineering, The University of Arizona, 2000
•	M.S.	:	Engineering Sciences, Middle East Technical University, Ankara, Turkey, 1994
•	B.S.	:	Civil Engineering, Middle East Technical University, Ankara, Turkey, 1991
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Employment

•	9/00-date	:	Aerospace and Mechanical Engineering, University of Arizona: Assistant Research Professor 9/00-6/07; Associate Research Professor 7/07-date
•	1/00-8/00	:	Intel Corp., Chandler, AZ: Internship
•	1/95-8/00	:	Aerospace and Mechanical Engineering, University of Arizona: Research Assistant
•	6/98-9/98	:	Hewlett Packard Company, Palo Alto, CA: Internship
•	9/98-12/98	:	Aerospace and Mechanical Engineering, University of Arizona: Teaching Assistant
•	1/92-12/94	:	Middle East Technical University, Ankara, Turkey: Teaching Assistant
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Publications  (since 2000, not including conference proceedings)

•	Grover, R., McCarthy, B., Sarid, D., and Guven, I., Mapping Thermal Conductivity Using Bimetallic Atomic Force Microscopy Probes, Appl. Phys. Let. 88: 233501, 2006.
•	Kay, N. R., Ghosh, S., Guven, I., and Madenci, E., A Combined Experimental and Analytical Approach for Interface Fracture Parameters of Dissimilar Materials in Electronic Packages, J. Mater. Sci. Eng. A 421:57-67, 2006.
•	Das, M., Guven, I., and Madenci, E., Coupled BEM and FEM Analysis of Functionally Graded Material Layers, J. Therm. Stresses 29:263-287, 2006.
•	Barut, A., Guven, I., and Madenci, E., A Meshless Grain Element for Micromechanical Analysis with Crystal Plasticity, Int. J. Numer. Methods Eng. 67:17-65, 2006.
•	Madenci, E. and Guven, I., The Finite Element Method and Applications in Engineering with ANSYS®, Springer Publishing Company, 2005.
•	Guven, I., Kradinov, V., Tor, J. L. and Madenci, E., Strain Energy Density Criterion for Reliability Life Prediction of Solder Joints in Electronic Packaging, ASME J. Electron. Packag. 126:398-405, 2004.
•	Guven, I., Madenci, E., and Chan, C. L., Transient Two-Dimensional Heat Conduction Analysis of Electronic Packages by Coupled Boundary and Finite Element Methods, IEEE Trans. Compon. Packag. Manuf. Technol. B: Adv. Packag. 25:684-694, 2003.
•	Guven, I., and Madenci, E., Thermoelastic Stress Field in a Piecewise Homogeneous Domain under Non-Uniform Temperature Using a Coupled Boundary and Finite Element Method, Int. J. Numer. Methods Eng. 56:381-403, 2003.
•	Guven, I., and Madenci, E., Transient Heat Conduction Analysis in a Piecewise Homogeneous Domain by a Coupled Boundary and Finite Element Methods, Int. J. Numer. Methods Eng. 56:351-380, 2003.
•	Madenci, E., Guven, I. and Kilic, B., Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS®, Kluwer Academic Publishers, 2002.
•	Barut, A., Guven, I., and Madenci, E., Analysis of Singular Stress Fields at Junctions of Multiple Dissimilar Materials Under Mechanical and Thermal Loading, Int. J. Solids Struct. 38:9077-9109, 2001.
•	Anderson, T., Guven, I., Madenci, E., and Gustafsson, G., The Necessity of Reexamining Previous Life Prediction Analyses of Solder Joints in Electronic Packages, IEEE Trans. Compon. Packag. Manuf. Technol. B: Adv. Packag. 23:516-520, 2000.
•	Sburlati, R., Madenci, E., Guven, I., Local Buckling of a Circular Delamination Along the Interface of an Elastic Layer and a Dissimilar Substrate with Finite Thickness, ASME J. Appl. Mech. 67:590-596, 2000.
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Research Projects  (since 2000)

•	Nano-Scale Material Modeling and Testing for New Interconnect and Packaging Technologies, Semiconductor Research Corporation, 7/1/06-6/30/09 (with E. Madenci).
•	Digital Image Correlation at Micro Level and Molecular/Continuum Mechanics Modeling for Electronic Packages, Semiconductor Research Corporation, 7/1/03-6/30/06 (with E. Madenci).
•	Testing and Simulation to Quantify the Influence of Moisture and Temperature on IC Package Reliability, LSI Logic Corporation/Semiconductor Research Corporation, 1/1/03-12/31/05 (with E. Madenci).
•	Functionally Gradient Partial Insert Development for Thin-Skin Sandwich Composite Structures, National Science Foundation (SBIR), 6/1/02-5/30/03 (with E. Madenci). Subcontract from Industrial Partner, Advanced Ceramics Research (ACR), Tucson, AZ.
•	Digital Image Analysis for Interface Characterization in Micro-Scale, Department of Radiology and Optical Sciences, The University of Arizona, 9/1/02-5/31/03 [equipment grant].
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